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Invitation to participate “International Space Science and Scientific Payload Competition” (ISSSP)

21 April 2022

Upcoming event

Beijing Institute of Technology co-organizes an interesting student competition “International Space Science and Scientific Payload Competition” (ISSSP) with Chinese Institute of Electranics, International Academy of Astronautics, China Space Foundation and Chinese Society of Astronautics.

ISSSP is committed to making full and effective use of rare space resources, promoting major scientific discoveries and innovative technological breakthroughs in the aerospace field, driving the civilization process of aerospace technology, promoting the sharing mechanism of innovative achievements, and realizing a space culture of co-construction, co-working, sharing and sharing. The competition is open to ACNET-EngTech members.

Please kindly find information on the poster, notice and registration form of ISSSP.
1. Notice on ISSSP
2. Registration Form

For registration, please send registration form to the official email address register@isssp.org.cn in the form of mail subject “Registration + Institution Name +Team Name”. 

For any further information and online registration, please visit the ISSSP’s official website (http://isssp.bit.edu.cn/) or contact via io@bit.edu.cn

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Invitation to participate "2022 ASEAN-Korea Academic Essay Contest"

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Hosei university’s Intensive Japanese Language & Culture Program (Winter 2026)

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[Call for Application] Asian Future Leaders Scholarship Program (AFLSP)

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Chulalongkorn University Social Research Institute Hosts International Conference on Global Leadership in Social Business Innovation, Commemorating the Launch of the Yunnus-Chula Social Business Center

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Upcoming event

[Call for Participation] Social Innovation for Impact & Sustainability Pitching Competition

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  • Home
  • About
    • Mission Statement
    • About
      • About Chula
      • About OIA
    • Our Team
    • Work With Us
      • Job Opportunity
    • Contact Us
      • Contact Information
      • Visit Request Form
    • Publications
  • Partnership
    • MoU
    • Partners
  • Global Academic Affairs
    • About Division
    • Student Mobility Program
      • Inbound Student Exchange
      • Outbound Student Exchange
      • Virtual Student Exchange
      • Visiting or free-mover student
    • Information for International Students
      • Information for International Students
      • International Student Orientation
      • Student ID Card and Bank Account
    • Information for Prospective Students
      • Information for Prospective Students
      • Chula Open House for International Programs
    • Staff Mobility Program
      • Chula International Staff Exchange Week
    • Collaborative Degree Program
    • Chula Summer Institute
  • Global Research & Innovation
    • About Division
    • Global Research and Innovation Initiative
    • Global Research and Innovation Promotion
    • International Research and Innovation Profiles
    • International Funding Opportunities
    • InfoEd SPIN: International Funding Opportunity Database
  • Global Networking & Engagement
    • About Division
    • SDGs Forums and Platforms
    • Global Citizenship
  • One-Stop Service
    • One-Stop Service
    • Admissions
      • Undergraduate admissions
      • Graduate Admissions
      • International Programs
  • News and Updates
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    • Recent news
    • Upcoming Event
    • Funding & Opportunity
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